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Semiconductor package
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31	[removed]Cypress Samples Its Second Generation USB Type C Controller in an Ultra Small Chip Scale Package for USB 3.1 Cables and Cable Adapters … About Us Add to Reading List Source URL: www.usb.org Language: English - Date: 2015-03-23 19:41:44 PSoC Cypress Semiconductor Universal Serial Bus USB 3.0 Microcontroller System on a chip Controller Computer hardware Electronic engineering Electronics
32	AUTOSWITCH TM STEREO AUDIO SWITCHER + SILENCE SENSOR Add to Reading List Source URL: www.henryeng.com Language: English - Date: 2009-09-25 15:21:45 Signage Dual in-line package 1N4148 Electronic engineering Electronics Electrical engineering Semiconductor devices Light-emitting diode Lighting
33	TCRT5000, TCRT5000L Vishay Semiconductors Reflective Optical Sensor with Transistor Output FEATURES • Package type: leaded Add to Reading List Source URL: www.electronicaestudio.com Language: English - Date: 2013-05-23 15:37:31 Technology Bipolar junction transistor Transistor Light-emitting diode Opto-isolator Semiconductor devices Electrical engineering Electromagnetism
34	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-13 17:05:57 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
35	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 16:24:43 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
36	R EADINESS OF 2.5D/3D IC PACKAGE D ESIGN E NVIRONMENT CONFIDENTIAL Copyright © 2014 BroadPak, Corp. All Rights Reserved. BroadPak Corporation Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-10-23 00:12:40 2.5D Information Copyright law of the United States Copyright Technology Data Semiconductor device fabrication Three-dimensional integrated circuit
37	FlipChip International: I MPLEMENTING TO SUPPORT GROWTH, OBTAIN REAL TIME COMMUNICATION AND RAPID PROBLEM SOLVING An AssurX interview with Sheila Mosher, VP of Information Technology Introduction Add to Reading List Source URL: www.assurx.com Language: English - Date: 2014-08-06 22:09:12 Quality management system Electronics Electronic engineering Semiconductor device fabrication Electronics manufacturing Technology Wafer-level packaging Chip scale package Flip chip Quality assurance
38	A Comparison of 3D Package Designs: Traditional Organic Substrates and Advanced Silicon Interposers GSA 3DIC Stacking Working Group Meeting July 17, 2013 Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:15 Integrated circuits Electronic engineering Technology Fabless semiconductor companies Rambus Three-dimensional integrated circuit Dynamic random-access memory Interposer Back end of line Computer memory Electronics Semiconductor device fabrication
39	1 This document is a draft of the manual for the GNU package Archimedes. Release 1.0 Add to Reading List Source URL: www.gnu.org Language: English - Date: 2012-05-27 03:47:12 Archimedes Home computers Retrocomputing Monte Carlo method NanoHUB Semiconductor Simulation GNU General Public License Science Open content Computing
40	Microsoft Word - 653X_rel_report Add to Reading List Source URL: www.maximintegrated.com Language: English - Date: 2013-02-13 09:08:20 JEDEC Electrostatic discharge Quad Flat Package Quad-flat no-leads package Solder Electromagnetism Physics Teridian Semiconductor

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